Wafer Inventory List

Updated on September 1, 2025
SiC Wafer Inventory
Size Type Grade Thickness Off-Angle Surface Finish
5 mm Semi-insulating Dummy 500 ± 25 um <0001> ± 0.2° Si Face: CMP Finish
C Face: Optical Mirror Finish (Mirror)
6 Inch 4H-N Dummy 350 ± 25 um 4˚ toward <11-20> ±0.5˚ Si Face: CMP Finish
C Face: Optical Mirror Finish (Mirror)
Si Wafer Inventory
Size Manufacturing
Method		 Conductivity
Type		 Dopant Diameter
(mm)		 Thickness
(µm)		 Finish Resistivity
(Ω·cm)		 Crystal
Orientation		 Stock
4 inch CZ N Phos 100 ± 0.5 525 ± 15 Single-Side Mirror 1 ~ 5 <100> ± 1° 175
4 inch CZ N Phos 100 ± 0.5 525 ± 15 Single-Side Mirror 1 ~ 5 <110> ± 1° 100
4 inch CZ P Boron 100 ± 0.5 525 ± 15 Single-Side Mirror 1 ~ 5 <100> ± 1° 150
4 inch CZ P Boron 100 ± 0.5 525 ± 15 Single-Side Mirror 1 ~ 5 <110> ± 1° 100
Size Manufacturing
Method		 Diameter
(mm)		 Thickness
(µm)		 Finish Resistivity
(Ω·cm)		 GBIR
(µm)		 Warp
(µm)		 Crystal
Orientation		 Stock
12 inch MCZ 300 ± 0.2 775 ± 25 Double-Side Mirror 1 ~ 100 ≤5 ≤80 <100> ± 1° 950
InP Wafer Inventory
Size Manufacturing
Method		 Conductivity
Type		 Dopant Diameter
(mm)		 Thickness
(µm)		 Finish EPD
(/cm2)		 Crystal
Orientation		 TTV
(µm)		 TIR
(µm)		 Bow
(µm)		 Warp
(µm)		 Stock
2 inch VGF N InP-S 50.0 ± 0.3 355 ± 15 Single-Side Mirror 37 - 166 (100)2°± 0.5° off
toward <110> α =225°		 ≤10 ≤10 ≤10 ≤10 10

We are able to accommodate specifications that are not currently in stock, offering superior quality, quick delivery, and competitive pricing.
If the specifications match your needs, please contact us.

Tel: 03-6751-7153
Fax: 03-6761-8935
Email: info@toyokou.co.jp