Single crystal silicon parts (wafers, targets, processed parts, etc.)
We provide a stable supply of high quality single crystal silicon parts. We can also accommodate small orders such as prototypes and research purposes.
Silicon wafers (for research and development, equipment testing, evaluation wafers), silicon processed products (counterbore processed products, hole processed products, cylindrical processed products, etc., various shape processing and surface treatments are possible according to your request)
Electronics Related
We provide a stable supply of high quality single crystal silicon parts.
We can also accommodate small orders such as prototypes and research purposes.
Wafers for research and development, equipment testing and evaluation
- We provide high-quality wafers such as single-sided mirror wafers from 2 inches to 12 inches and oxide film wafers.
- Depending on your needs, we can provide finishes such as square wafers, round wafers without OF (orientation flat), double-sided mirrors, double-sided etching, and double-sided wrapping.
- Wafer thickness can be manufactured from 100 μm (4 inches) to 2,000 μm.
Wafers for sensors and MEMS
We provide high-precision wafers that can be used to create precise grooves for sensor and MESM applications, using deep etching processing.
- Smaller surface orientation (cutting angle) tolerance
- Smaller OF position angle tolerance
- Smaller thickness tolerances
- More accurate flatness
Plate material (material for targets, etc.)
We provide parts for various semiconductor-related manufacturing equipment, including sputtering targets that require high precision, high purity, and high-temperature characteristics, and liquid crystal manufacturing equipment, in shapes and finishes that meet customer requests.
Shape Example
- Shape: round, square
- Chamfering: R chamfering, C chamfering, thread chamfering
- Surface finish: mirror surface, etched surface, lapped surface, ground surface, sliced surface
Specially Processed Products
As high-purity material parts for various manufacturing equipment, we perform various shape processing and surface treatment according to customer's request and provide products.
Processing Example
- Male and female thread processing
- Large and small ring processing
- Circle, prismatic processing
- Large and small hole drilling
- Counterbore processing
- Slit processing
Cylindrical Processing
Ring Processing
Counterboring 1
Counterboring 2
Wafers for research and development, equipment testing and evaluation
- For research and development
- For semiconductor device testing and evaluation
- For resist and coating material evaluation
- Substrate for membrane evaluation
Wafers for sensors and MEMS
- For MESM processing such as waveguides and sensors
Plate material (material for targets, etc.)
- For LCD manufacturing
- For touch panel manufacturing
Specially processed products
- Parts for semiconductor manufacturing equipment
- Wafer transport tray (counterbore processed product)
Single crystal silicon wafer overview
- We provide single-sided and double-sided mirror wafers and wafers with oxide film from 2 inches to 12 inches.
- In addition to standard specification products (standard stock available from 2 to 6 inches), we also handle special specification products for specific applications.
- We also handle chip processing, etc.
- 8inch, 12inch, SOI, etc. need consultation
Standard wafer specifications
| Size | Finishing | Type | Diameter | Thickness | Resistivity | Orientation | OF position | OF width | Particle |
|---|---|---|---|---|---|---|---|---|---|
| ― | ― | (mm) | (μm) | (Ωcm) | ― | ― | (mm) | (Pieces/W) | |
| 2inch | single sided mirror | P-type (Bo) | 50±0.5 | 280±25 | 0.1～100 | (100) | (110) | 17.5±2.5 | ≧0.3μm ≦10 |
| single sided mirror | N-type (Ph) | 50±0.5 | 280±25 | 0.1～100 | (100) | (110) | 17.5±2.5 | ≧0.3μm ≦10 | |
| 3inch | single sided mirror | P-type (Bo) | 76±0.5 | 380±25 | 0.1～100 | (100) | (110) | 22.5±2.5 | ≧0.3μm ≦10 |
| single sided mirror | N-type (Ph) | 76±0.5 | 380±25 | 0.1～100 | (100) | (110) | 17.5±2.5 | ≧0.3μm ≦10 | |
| 4inch | single sided mirror | P-type (Bo) | 100±0.5 | 525±25 | 0.1～100 | (100) | (110) | 32.5±2.5 | ≧0.3μm ≦10 |
| single sided mirror | N-type (Ph) | 100±0.5 | 525±25 | 0.1～100 | (100) | (110) | 32.5±2.5 | ≧0.3μm ≦10 | |
| 5inch | single sided mirror | P-type (Bo) | 125±0.5 | 625±25 | 0.1～100 | (100) | (110) | 42.5±2.5 | ≧0.3μm ≦10 |
| single sided mirror | N-type (Ph) | 125±0.5 | 625±25 | 0.1～100 | (100) | (110) | 42.5±2.5 | ≧0.3μm ≦10 | |
| 6inch | single sided mirror | P-type (Bo) | 150±0.5 | 625±25 | 0.1～100 | (100) | (110) | 47.5±2.5 | ≧0.2μm ≦10 |
| single sided mirror | N-type (Ph) | 150±0.5 | 625±25 | 0.1～100 | (100) | (110) | 47.5±2.5 | ≧0.2μm ≦10 |
Compatible with special specification wafers
We also support products with special specifications that match the application.
Special specification wafers are available from 2 to 6 inches.
Wafer specification example
| Surface Finish | Single-sided mirror, double-sided mirror, double-sided etch, double-sided wrap, etc. |
|---|---|
| Thickness | 100～2000μm |
| Thin | 100μm (Only 4 inch available) |
| Thick Material | 1,000 ～ 2,000μm ※Up to 1mm (1000μm) is usually packed. >1mm thick products are packaged in plastic bags, so cleanliness cannot be guaranteed. |
| Resistivity | Standard 1~100Ωcm, low resistance ≦0.02Ωcm, high resistance ≧1000Ωcm. ※Consult us for resistivity |
| Orientation | (100) (110) (111) ※Consult separately for standard (100), (110) and (111) |
| Flatness, Particles | ※Consultation Required |
| Oxidation | Standard oxidation thickness 100nm to 1000nm. Other than that, please consult us. |
| Other film formation: various metal films, SiN, etc. | ※Consultation Required |
Silicon single crystal (other processed products)
We provide plate materials for sputtering targets, counterbore jigs for equipment transport, etc. in shapes and finishes according to customer requests.
- 【Example of plate shape】
- ☆Shape: circular, square
☆Chamfering R chamfering, C chamfering, thread chamfering
☆Surface finish: mirror surface, lapped surface, etched surface, ground surface, sliced surface
- 【Counterbore processed product】
- ☆consultation required
Square plate
Round plate
Counterbore processed product