Equipment Parts Processing Business

Equipment Introduction

Gliding Center

By taking advantage of these features, machining time can be significantly reduced compared to conventional machining. For example, with SiC,the feed rate is approximately twice as high.

Model GC-7 OKK Co., Ltd.

Table Dimensions
1,550 × 740 mm
Spindle Speed
12,000rom
Taper No.50
X Movement Amount 1,530
Y Movement Amount 740
Z Movement Amount 660 mm

Laser automatic tool measurement function reduces machining time.

Equipped with a chip conveyor, filter, centrifuge, and mist separator to remove sludge and moisture.

Equipped with a 7 MPa high-pressure coolant unit that powerfully removes sludge adhering to tools and prevents clogging.

What can a gliding center do?

Cutting

We use drills, end mills, and blades to process flat surfaces, sides, grooves, and arcs. Mainly metal processing.

Grinding

Shape processing and final polishing of flat surfaces and sides are performed using diamond electrodeposition tools and grindstones. Ceramics, SiC, MMC, super steel alloys, etc.

Processing Example

Processing Classification

Grinding Material Classification Cemented Carbide

Tapping of Cemented Carbide

We can process taps from M3 to large diameter taps in a short time.We can process difficult-to-cut materials regardless of the type of carbide.

Cemented Carbide
High Hardness (HRA 80 to 94)
High Strength (transverse rupture strength approximately 2 GPa) or higher
Young's modulus is large (approximately 3 times that of iron)
High specific gravity (approximately twice that of iron)

It is one of the materials that are difficult to process.

Select the tool as shown below depending on the required accuracy.

Screw Accuracy
JIS 1 Class
(General 2 Class)

<For General-Purpose Tapping>

YOKOCERA M5-01

<For Precision Tap Processing>

Asahi Diamond HTM-5X11

Processing Classification

Grinding Material Classification Alumina Ceramic

High-precision circular machining of ceramics

High precision circular processing
Roundness: 3 μm or less

Roundness 2.46 μm

Tools Used

Electroplated Tool

Equipment Used

OKK GC7

Accuracy: Roundness
3μm or less

Processing Classification

Grinding Material Classification SiC

Machining of SiC Materials

We perform high-precision drilling, shape processing, and grinding on high-hardness SiC materials.

Example) Reduction of processing time by 50%

The feed rate has been improved from 150 to 300 mm/min (cutting in at 0.01 mm).

SiC (Silicon Carbide)

SiC (Silicon Carbide) is the hardest, most wear-resistant, and corrosion-resistant material among fine ceramics.

Processing Classification

Grinding Material Classification Heat Resistant Tempered Glass

Processing of Heat-Resistant Tempered Glass

We perform precision drilling and shaping of heat-resistant tempered glass.

Example of High-Precision Shape Processing

Pitch/Diameter Accuracy
Below 10 μm

Special Processing to Minimize Chipping

Processing Classification

Grinding Material Classification Macall

Makor (Free-Cutting Ceramic) Processing

Makor (Free-Cutting Ceramic) is Processed With High Precision.

Possible to process holes with a diameter of φ100μm or more
Capable of tapping and grooving from 100 μm
● What is Makor (Machinable Ceramics)
A new ceramic material that shares the characteristics of glass and ceramics and the ease of metal processing. normal ceramics Impossible ultra-precision finishing or, Processed into complex shapes Is possible.

Example of product of groove type air pad

Processing Classification

Grinding Material Classification Hardened Material

Shape processing after quenching

Hot die steel SKD61 ※Test data next page

Processing Example

Pre-heat treatment processing

Post-heat treatment finishing process

Tools used

Processing Accuracy
(Target ± 10 μm)
Position 10 μm
Shape 10 μm

Make Categories Hand

Hand Production for Semiconductor Wafers

  • Various precise shape processing
  • Surface accuracy construction of the suction surface
  • Conductive fluorine coating
  • Simple air leak test
  • Precision cleaning compatible with clean specifications

Production Flow

Air leak test of the suction surface by the wafer

External cleaning and clean spec packaging

Make Categories Straightedge

Making a straightedge

  • We will make it to your desired size.
  • Straightness: 2 μm, flatness: 1 μm

Material: Alumina ceramics 90%

Make Categories Square Ruler

Making a Right Angle Master

  • We will make it to your desired size.
    The photo is 500 mm square
  • Straightness: 2 μm, flatness: 1 μm

Material: Alumina ceramics 90%

Make Categories Straightedge

Manufacture of a straight edge (square)

  • We will custom make to your desired size.
    Up to 80 × 80 × 3,200 mm
  • Straightness 2 μm, Flatness 1 μm

Material: Alumina Ceramics 90%

Production Example Using a Straight Edge Rule (L-Shaped)

Air Slider Type Straightness Measuring Device

Polishing of Wide Gap Semiconductor Materials

Material
SiC (Silicon Carbide), GaN (Gallium Nitride), Sapphire Wafers, etc.
Specifications
2, 3, 4 and 6 inch wafers
  • SBIR ≦ 1 μm
  • GBIR ≦ 2 μm
  • Ra ≤ 0.1 nm or less
Quality
Quality assurance by the latest inspection equipment
  • Candela
  • NIDEK
  • AFM
  • TXRF
  • Edge Profiler
Features
High flatness and heavy metal-free cleaning
  • Substrate polishing
  • Epi-growth wafer backside polishing
  • Patterned wafer polishing (edge trimming + backside polishing + heavy metal-free cleaning)
  • Used wafer regeneration polishing
  • Edge trimming and laser marking

Polishing (Lap & Polish) Equipment

Compound Semiconductor Wafer Polishing

Material
Substrate wafers such as GaP, GaAs, InP, epi-grown wafers, patterned wafers
Specifications
2, 3, 4, 6-inch regular and irregular wafers
  • Super thin finish possible (up to 50μm level)
  • Substrate polishing has epi-ready surface quality
Quality
Quality assurance by the latest inspection equipment
  • Candela
  • NIDEK
  • AFM
Features
  • Ultra-thin finish
  • Supports irregular wafers

Polishing (Lap & Polish) Equipment