Metal-Based Composite Materials
- MMC (Ai/SiC Composite Material)
- We provide metal-based composite materials such as Metal Matrix Composites (Ai/SiC) and Cu-Mo, which are primarily used in spacers, substrates, and housings.
Spacer
- Introduction
- Double-sided cooling technology is a new structural technology for recent power module products, effectively reducing the parasitic inductance and resistance of the device, and effectively improving the power density and reliability of the device. This product serves primarily as a key material for devices such as double-sided cooling devices, playing a crucial role in "thermal conduction", "electrical conduction", and "support".
- Application Fields
- Spacer-related products are used in fields such as new energy vehicles, power elctronics, and smart grids.
- Product Features
-
- High thermal conductivity
- Low expansion
- High electrical conductivity
- Strong bonding
- Good weldability
| Material | AlSiC | MoCu |
|---|---|---|
| Volume Fraction (Vol%) | 55-65 | 40 ± 2 |
| Thermal Conductivity (W/m·K) | 200 ± 20 | 300 ± 20 |
| Thermal Expansion Coefficient (×10-6/K) | 9-11 | 10-13 |
| Electrical Conductivity (mS/m) | >6 | >40 |
| Density (g/cm3) | 2.93 ± 0.03 | 9.42 ± 0.03 |
| Titanium Plating (μm) | <0.5 | / |
| Nickel Plating (μm) | 8-12 | 3-7 |
| Copper Plating (μm) | 20-30 | / |
| Silver Plating (μm) | 4-8 | 4-8 |
Baseplate
- Introduction
- AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.
- Application Areas
- Substrate-related products are applied in fields such as railways, smart grids, and power electronics.
- Product Features
-
- High thermal conductivity
- Low expansion
- High rigidity
- Strong bonding
- Good weldability
| Material | AlSiC |
|---|---|
| Volume Fraction (Vol%) | 65-70 |
| Thermal Conductivity (W/m·K) | 200 ± 20 |
| Thermal Expansion Coefficient (×10-6/K) | 6.5-9 |
| Electrical Conductivity (mS/m) | >6 |
| Density (g/cm3) | 2.97-3.1 |
| Copper Plating (μm) | 8-12 |
| Gold Plating (μm) | >1.3 |
Housing
- Introduction
- With the development and evolution of diamond tools in the machining industry, AlSiC housing has become machinable into various complex shapes. AlSiC housing is used as an excellent packaging material due to its superior thermodynamic and mechanical characteristics, light weight, and excellent air tightness.
- Application Fields
- Housing related products are applied in fields such as phased array radar, aerospace, and satellite communications.
- Product Characteristics
-
- High thermal conductivity
- Low expansion
- Low density
- High air tightness
- Strong bonding
- Good weldability
- High dimensional stability
| Material | AlSiC |
|---|---|
| SiC content (Vol%) | 65 |
| Thermal Conductivity (W/m·K) | 200 ± 20 |
| Coefficient of Thermal Expansion (×10-6/K) | 6.5-9 |
| Flexural Strength (MPa) | ≥300 |
| Density (g/cm3) | 2.93-3.1 |
| Air Tightness Pa·m3/s | <10-9 |
| Nickel Plating (μm) | 8-12 |
| Gold Plating (μm) | >1.3 |
| Silver Plating (μm) | 4-8 |