日本語
SiC
GaN
Silicon
Silicon Parts For Equipment
Semiconductor Substrate Material
Equipment Parts Processing Business
日本語
Copyright © 2024 TOYOKOU WAFER By TOYOKOU INC.
All Rights Reserved.
Spinel and Coesite
Material: Spinel, Cordierite.
Diameter: 4 or 6 inch
Thickness: 350-750±25μm (Customized)
Polytype: Poly-Crystalline
TTV: ≤5μm
Warp: ≤35μm
Front-Surface Roughness: Ra≤0.5nm(5μm×5μm)
Back-Surface Roughness: Ra≤2.0nm(5μm×5μm)