Material

Substrate wafers such as GaP, GaAs, InP, epitaxial growth wafers, patterned wafers

Specifications

2, 3, 4, 6 inch standard and irregular wafers

• Super thin finish possible (up to 50μm level)
• The substrate polishing has epi-ready level surface quality

Quality

Quality assurance by state-of-the-art inspection equipment

• Candela
• NIDEK
• AFM

Features

• Ultra-thin finish
• Support for irregular-shaped wafers

Lapping and polishing equipment